Applied Materials (NasdaqGS:AMAT) has entered a new advanced packaging technology partnership with Broadcom. Broadcom is ...

Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its ...

Quick Read Lam Research (LRCX) reported Q1 FY26 revenue of $5.84B with 50% gross margins and 35% operating margins, with next ...

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

Lam Research has launched a new research lab in Salzburg, Austria. This facility will focus on advanced chip packaging ...

TSMC introduces A13 and N2U chip technologies, leveraging existing ASML EUV machines TSMC plans advanced chip-packaging for AI, enabling larger, more complex chips Experts note advanced packaging ...

By Toby Sterling ANTWERP, Belgium, May 20 (Reuters) - The booming global semiconductor market will be "tense" with tight ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...