The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...

In the center of this technological transition, Future Leading SiSiC/RBSIC/silcon carbide Cantilever Paddle products are emerging as a key solution for stable wafer handling and continuous kiln ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

The inevitable move to one-at-a-time wafer processing, expected to come about in the 300mm-wafer generation, is almost certain to have a dramatic impact on the manufacturing supply chain, according to ...

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

Korea University researchers have developed a machine-learning framework that predicts solar cell efficiency from wafer quality, enabling early wafer screening and optimized production paths. Using ...

TOKYO — In a major boost for silicon-on-insulator technology, Toshiba Corp. will adopt Canon Inc.'s Eltran SOI wafer process for broadband microprocessors built in 0.1-micron and 0.07-micron process ...

Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...

CONCORD, Calif.--(BUSINESS WIRE)--Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma cleaning technology, introduces its Plasma Confinement Ring for wafer processing and wafer ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...